Contour drilling and milling
Thanks to our self-developed processes, we can drill, cut or mill every conceivable shape in glass - without even touching it! Therefore we can dispense the necessary consumables, coolants and their preparation in the conventional process and make a small contribution to environmental protection. And we are also a little proud of this!
Material thickness: 0.7-20 mm
Component size: max. 1000x2400 mm
Machining area: max. 100x100 mm
Accuracy: ±30 μm
Minimum joint width: 250 μm
Learn more about the glass products worth seeing after our laser processing here.
Decoating
The laser processes developed by cericom also allow the removal (decoating) and structuring of glass coatings of commercially available soft coatings as well as various hard coatings. Depending on the type of coating and the desired quality of the exposed glass surface, you can choose from our various laser processes ...
Material thickness: 0.7-50 mm
Component size: max. 1000x2400 mm
Accuracy: ±50 μm
Internal glas engraving
Internal glass engraving is still a rather uncommon and sensational type of laser processing of glass.
Material thickness: 0.7-50 mm
Component size: max. 1000x2400 mm
Accuracy: ±50 μm