The LiSEC ceriDrill series embodies the highest standards of sustainability: featuring no consumables, no tools, minimal power consumption, and a dry process, it delivers maximum efficiency in a compact footprint.
Many pre- and post-processing steps can be eliminated, allowing for direct tempering of the glass right after drilling and cleaning.
Lisec’s new ceriDrill 14 is equipped with cericom’s laser ceriDrill technology and is designed for vertical laser drilling of optically transparent brittle materials, either as a standalone machine or fully integrated in the production line. This machine allows high precision drilling of single pieces or series within a working area of 100 x 100 mm2 along any 2D curves including one-sided chamfers and countersink holes.
It is now possible not only to process materials with thicknesses up to 20 mm, but also to drill holes with diameters down to 2 mm at water jet speeds or even faster. A minimum of operating costs, stress-free glass processing with zero water consumption provides exceptional lifespan and therefore an excellent return on your investment. Laser drilling is constantly being developed and installed on new machines – ask your Lisec sales representative for the latest information!
