c-cut 300/300 | Laser Glass Drilling / Milling Machine

c-cut is a machine designed for laser cutting, drilling and milling of optically transparent brittle materials, primarily for laser processing of glass. This machine enables high precision cutting and drilling of glass within a processing area of 100 x 100 mm2 along arbitrary 2D or 3D curves (based on drawings). Now, it is not only possible to cut materials with thicknesses of 20 mm and more but also to drill holes with diameters down to 200 µm and achieve aspect ratios larger than 1:25. The drilling and cutting and milling processes are completely “dry“. Therefore the laser processes do neither require any water nor the accompanying water recycling systems.

A very narrow kerf width combined with high accuracy and resolution enables cuts that are currently not possible with any conventional glass processing technology. For the first time, the laser-based process used in the c-cut machine enables an effective way for laser milling of glass. For example, countersunk holes, tapered holes and other virtually arbitrary 3D structures can be milled into the glass surface with ease and precision.


  • “Dry” process
  • High hole aspect ratio
  • Small processing features > 0.2 mm
  • High precision and standard versions
  • Integration in production lines

Completely dry process



High precision
c-cut 300/300-60
c-cut 300/300-100
Laser source  
Laser sourcefiber laserfiber laser
Laser wavelength515 nm515 nm
Average power50 W50 W
Optical system  
Beam delivery systemoptical fiber, 3 moptical fiber, 3 m
ShapeArbitrary (cut according to drawing)Arbitrary (cut according to drawing)
MaterialGlass, brittle materials transparent for visible spectrumGlass, brittle materials transparent for visible spectrum
Material thickness0.7...20 mm0.7...20 mm
Maximum work piece size300 x 300 mm300 x 300 mm
Minimum hole size, Ø(4)Ø 0.5 mmØ 0.7 mm
Maximum cut area60 x 60 mm100 x 100 mm
Drilling/cutting speed(4) (5) (6)15 mm² / s12 mm² / s
Aspect ratio (hole diameter: drill depth)1:251:18
Accuracy(7)±25 μm±30 μm
Taper< 2°< 2°
Minimum kerf width(4)200 μm250 μm
Control systemfull numerical control, built-in industrial computer with OS Windowsfull numerical control, built-in industrial computer with OS Windows
Coolingwater cooling, built-in chiller (8)water cooling, built-in chiller (8)
Power supplysingle phase, 220-240 VAC, 50 Hzsingle phase, 220-240 VAC, 50 Hz
Power consumption
(Laser, built-in chiller, without suction system)
Max 2000 WMax 2000 W
Dimensions (W x D x H) (9)1300 x 810 x 20001300 x 810 x 2000
Weight380 kg380 kg
Operating conditionsambient temperature: 20..30°C
humidity: < 80% (without condensation)
ambient temperature: 20..30°C
humidity: < 80% (without condensation)

(1) – depends on material, thickness, part size, shape, processing speed
(2) – speed is given in mm/s per 1 mm of material thickness
(3) – calculation passed on the processing time of Ø 20 mm hole in 4.0 mm thick soda lime glass

(4) – standard configuration, ambient temperature in the range of 20..30°C, can be improved on special request.
(5) – if required, the chiller can be installed separately, maximum coolant hoses length 3 m 7
(6) – without monitor